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Pasta za CPU hladnjak GEMBIRD TG-G3.0-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive
Proizvođač: Gembird
Dostupnost: Dostupno
Jedinstvena šifra artikla: 25109
7,00 KM sa PDV-om

Specifications
Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%

http://www.gmb.nl/item.aspx?id=8313

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